With the acquisition of Swedish company Webra, Seifert Electronic has acquired skiving technology. This technology offers engineers new design freedom where conventional heatsinks fall short. Seifert's Flexfin Skiving heatsinks are manufactured from a single piece of material – without adhesives, solder, or mechanical connections. This creates a thermally homogeneous structure with optimal heat conduction.
In skiving, fins are "peeled" directly from a solid block of aluminum or copper. This prevents contact resistance between the fin and the base. Aluminum EN AW-1060 or EN AW-6063 with a thermal conductivity coefficient of up to 230 W/mK is used as the base material; for extremely high-power applications, copper (Cu110) can also be used.
Thanks to the direct connection between the base and fins, Flexfin heatsinks are not only more efficient but also lighter and more durable. The one-piece construction eliminates the drawbacks of fin separation and aging of connecting materials.
The technology also offers great design freedom:
- cooling profile width <1000mm
- cooling profile length <500mm
- fin height from 3–140 mm
- fin spacing of 0.3–6.5 mm
- base thickness up to 30 mm
For thermally demanding applications such as high-power modules, power electronics, or thermoelectric systems, skiving offers an attractive alternative. Moreover, small series and prototypes can be quickly produced without expensive tooling costs.
The message Skiving technology for compact and efficient cooling solutions first appeared on Elincom.
Source: https://www.elincom.nl/nieuws/skiving-techniek-voor-compacte-en-efficiente-koeloplossingen/
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