Accelonix BV

Accelonix BV is a solution provider for many types of test and production applications in electronic manufacturing and development.
Since more than 25 years, we have accumulated particular expertise in the high technology fields of EMC and RF testing, automated test equipment and software for PCB Assembly Test and Inspection as well as automated assembly equipment for Microelectronics, Hybrid, Chip-on-Board and Battery Bonding.

Since many years we also offer local services:

• Testing PCB assemblies with Flying Probe test, JTAG Test and X-Ray Inspection
• Bonding prototypes and low volume production such as batterypacks, sensors, chip-on-board and more.

Our solutions:

EMC & RF Test for Commercial, Industrial, Automotive, Military and Telecom Applications

• Transient test generators: EFT/Burst, Surge, ESD
• Harmonics, flicker and power fail test solutions
• Automotive and EV transient generators
• RF generators
• RF analysers
• Antennas
• Conducted test accessories: LISN, CDN, Clamps, Probes, and more
• RF and microwave amplifiers
• Test Environments: semi and full anechoic chambers, GTEM cells
• EMI Filters

Test and Software Solutions for PCB Assembly

• Software solutions for DFT, test coverage analysis, CAD/CAM, New Product Introduction
• Automated optical inspection: 3D solder paste inspection, 3D AOI for SMT and THT components
• JTAG/Boundary Scan: In-System Testing and Programming
• Flying probe test: single side and double side PCBA test
• X-Ray inspection: inline automated X-Ray, manual analysis X-Ray systems
• Device programming: automated programmers, in-system programming
• Repair and troubleshoot: analog signal analysers for repair of undocumented PCBA

Microelectronics Assembly and Battery Bonding

• Dicing and sawing for wafers, glass, ceramics and more
• Dispensing of epoxy, solderpaste�
• Die sorting and die bonding: automated and semi-automated systems
• Wirebonding for fine wire: automated and manual systems
• Bonding for heavy wire and batteries: wire bonding and tab bonding solutions
• Bond Testing: wire bond and die shear test
• Plasma Cleaning

Metrology

• 3D non-contact surface metrology
• Thermal warpage and strain
• Micro CT: computed Tomography